7Semi ICM20948 + BMP585 10DOF IMU Breakout – 9Axis MEMS MotionTracking With Pressure Sensor

Resources

ICM20948 Datasheet
BMP585 Datasheet
STEP FILE
DFX FILE

10DOF IMU Breakout Board For Motion-Sensing Pressure Monitoring And Embedded Navigation
The 7Semi ICM20948 + BMP585 10DOF IMU Breakout is a compact sensor module built for motion-aware and environment-aware embedded systems. It combines a 9-axis MEMS MotionTracking sensor with a high-accuracy pressure sensor, making it well-suited for drones, robotics, wearable devices, IoT nodes, navigation systems, and portable electronics. With support for both I2C and SPI communication, this IMU breakout board offers flexible integration across development boards, microcontrollers, and custom hardware designs.
Designed for low-power operation, this breakout board helps developers add orientation sensing, acceleration measurement, angular rate detection, magnetic field sensing, and pressure monitoring in a single module. The onboard Digital Motion Processor improves motion-processing capability for real-time applications, while the compact 23 x 17 x 6.3 mm form factor makes it suitable for space-constrained designs. Its wide operating pressure range and industrial temperature support also make it a practical choice for advanced sensing projects.
Features

10DOF Sensing: Combines 3-axis gyroscope, 3-axis accelerometer, 3-axis compass, and BMP585 pressure sensor in one board.
Low-Power Operation: Consumes only 2.5 mW, making it well-suited for battery-powered and portable devices.
Flexible Communication: Supports both I2C and SPI interfaces for easy system-level integration.
Programmable Gyroscope Range: Offers selectable full-scale ranges of +-250 dps, 500 dps, 1000 dps, and 2000 dps.
Programmable Accelerometer Range: Supports +- 2 g, 4 g, 8 g, and 16 g for different motion-sensing needs.
Wide Magnetometer Range: Measures magnetic field up to +- 4900 uT for compass-based applications.
Pressure Monitoring: BMP585 sensor supports full-accuracy pressure measurement from 300 hPa to 1250 hPa.
Onboard Motion Processing: Integrated Digital Motion Processor supports efficient motion-analysis tasks.
Embedded-Ready Design: Includes digital temperature sensing, EIS FSYNC support, Android support, and auxiliary I2C for external sensors.
Compact Form Factor: Small module size helps in drones, robotics, navigation, and IoT product designs.